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PCB-Herstellung
Wir bieten Kunden One-Stop-PCB-Lösungen, spezial isiert auf die Forschung und Entwicklung, Produktion und Vertrieb von starren Multilayer-Leiterplatten (MLB), High-Density-Leiterplatten (HDI), flexible Leiterplatten und Montage (FPC & FPCA), starre flexible Anschluss platinen (R-F), und Träger platinen (ICSubstrate). Wir sind ein wichtiges High-Tech-Unternehmen im nationalen Fackel programm, eine stell vertretende Vorsitzende der China Electronics Circuit Industry Association (CPCA) und eine der CPCA-Industries tandard einheiten. Wir sind ein fort geschrittener Agent in Industrie technologie und Produkt qualität in China.
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PCB-Lösung aus einer Hand
Hard board MLB, HDI, HLC Soft board FPC, FPCA, RF-Träger platine
Intelligente Fertigung
Effizientes automat isiertes Design der Produktions linie und Einführung von MES, EAP, QMS, CRM und anderen Informations systemen
Voller Service
Technischer Support für Forschung und Entwicklung vor dem Verkauf, schnelle Reaktion auf After-Sales-Service, globales Service-Basis layout
Zartes Management
Produkt rück verfolgbar keits management, Formel freigabe und Produktion TPM, TQM
Technologie-Roadmap
Hohe Schicht zahl
| Technical characteristics | 2024 | 2025 | 2026 | ||||
| Mass | Sample | Mass | Sample | Mass | Sample | ||
| Max. Layer Counts (Layers) | 36 | 48 | 40 | 52 | 44 | 56 | |
| Max. board thickness (mm) | 6 | 10 | 6 | 10 | 6 | 10 | |
| Min. board thickness (mm) | 0.5 | 0.4 | 0.4 | 0.3 | 0.4 | 0.3 | |
| Shipment size (mm) | 710*1250 | 710*1250 | 710*1250 | 710*1250 | 710*1250 | 710*1250 | |
| Min. BGA pitch (mil） | 20 | 16 | 16 | 16 | 16 | 16 | |
| Registration in Same Core (mil) | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | |
| Registration in Adjacent Core (mil) | 2 | 1.2 | 1.6 | 1.2 | 1.6 | 1.2 | |
| Overall Registration (mil) | 4 | 3.5 | 4 | 3 | 4 | 3 | |
| Min. Drill Size (D) / Pad size (D+X): (mil) | D+7 | D+6 | D+7 | D+6 | D+7 | D+6 | |
| Drill | Min. Drilling Size (mm) | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 |
| Min. Laser Drilling Size (mm) | 0.1 | 0.075 | 0.075 | 0.075 | 0.075 | 0.075 | |
| Aspect Ratio | Drilling Size 0.15mm | 16:1 | 18:1 | 16:1 | 18:1 | 16:1 | 18:1 |
| Drilling Size 0.2mm | 20:1 | 23:1 | 20:1 | 25:1 | 20:1 | 25:1 | |
| Drilling Size 0.25mm | 20:1 | 25:1 | 22:1 | 25:1 | 22:1 | 25:1 | |
| Laser Drilling Size 0.2mm | 1.2:1 | 1.2:1 | 1.2:1 | 1.2:1 | 1.2:1 | 1.2:1 | |
| Laser Drilling Size 0.075mm | 0.8:1 | 1:1 | 0.8:1 | 1:1 | 0.8:1 | 1:1 | |
| Impedance tolerance | Inner Layer | ±7% | ±5% | ±6% | ±5% | ±6% | ±5% |
| Outer Layer | ±8% | ±8% | ±8% | ±7% | ±8% | ±7% | |
| Min. inner linewidth/space | 1/2oz Cu: (mil) | 3/3 | 2.5/2.5 | 2.5/2.5 | 2.0/2.0 | 2.0/2.0 | 1.6/1.6 |
| 1oz Cu: (mil) | 3/3.5 | 3/3 | 2.8/3.2 | 2.5/3 | 2.8/3.2 | 2.5/3 | |
| 2oz Cu: (mil) | 5/5 | 4.5/5 | 4.5/5 | 4/4.5 | 4.5/5 | 4/4.5 | |
| Min. outer linewidth/space | 1/3 OZ+Plating:(mil) | 3/3 | 2.5/3 | 2.5/2.5 | 2.5/2.5 | 2/2.5 | 2/2.5 |
| 1/2 OZ+Plating:(mil) | 3/3.5 | 3/3.2 | 3/3.2 | 2.8/3 | 2.8/3 | 2.8/3 | |
| 1/3 OZ+Plating (POFV):(mil) | 3.2/3 | 3/3 | 2.8/3 | 2.5/2.8 | 2.5/3 | 2.5/3 | |
| 1/2 OZ+Plating (POFV):(mil) | 3.5/3.5 | 3.2/3.5 | 3/3.5 | 3/3.2 | 3/3 | 3/3 | |
| Vacuum resin plughole | Min. hole size (mil) | 7.9 | 5.9 | 7.9 | 5.9 | 7.9 | 5.9 |
| AR @ 7.9 mil hole | 23:1 | 25:1 | 25:1 | 25:1 | 25:1 | 25:1 | |
| Solder mask | Registration (mil) | ±1.2 | ±1.0 | ±1.2 | ±1.0 | ±1.2 | ±1.0 |
| Min. SM dam width (mil) | 2.8 | 2.5 | 2.8 | 2.5 | 2.8 | 2.5 | |
| SM plugging AR | 14:1 | 16:1 | 14:1 | 16:1 | 14:1 | 16:1 | |
| Back drill | Hole to copper(mil) | 5.0 | 4.5 | 5.0 | 4.5 | 5.0 | 4.5 |
| Stub length(mil) | 6±4 | 4±2 | 5±3 | 4±2 | 4±2 | 4±2 | |
| Min. core thickness (mil) | 2 | 2 | 2 | 2 | 2 | 2 | |
| Min & max copper thickness (OZ) | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | 1/3 ~ 6 | |
| Min. press fit hole tolerance (mil) | ±2.0 | ±1.8 | ±1.8 | ±1.8 | ±1.8 | ±1.8 | |
| Surface finish | ENIG,ENIG+OSP, Immersion Sn/Ag, G/F+OSP,G/F+ENIG, ENEPIG | ||||||
HDI
| Technical characteristics | unit | 2024 | 2025 | 2026 | |||
| Mass | Sample | Mass | Sample | Mass | Sample | ||
| Layers | / | 12 | 14 | 12 | 14 | 12 | 14 |
| Board structure | / | 3+n+3 | AnyLayer(12) | AnyLayer(12) | AnyLayer(14) | AnyLayer(12) | AnyLayer(14) |
| Min. board thickness（10L） | mm | 0.65 | 0.6 | 0.6 | 0.55 | 0.6 | 0.55 |
| Min. dielectric thickness | mm | 0.040（1037） | 0.035（1027） | 0.035（1027） | 0.025（1017） | 0.03 | 0.025 |
| Bow & Twist | / | ≤0.5% | ≤0.4% | ≤0.5% | ≤0.4% | ≤0.5% | ≤0.4% |
| Min. line width / spacing of inner layer | um | 40 / 50（whole） | 40 / 40（Part） | 40 / 40（whole） | 35 / 50（whole） | 35 / 40（whole）mSAP | 30 / 30（Part）mSAP |
| Min. line width / spacing of outerlayer | um | 50 / 50（whole） | 40 / 50（Part） | 40 / 50（whole） | 40 / 40（whole） | 40 / 40（whole）mSAP | 35 / 40（Part）mSAP |
| Min. BGA pitch | mm | 0.325 | 0.30 | 0.325 | 0.30 | 0.325 | 0.30 |
| Min. via size | um | 75 | 65 | 65 | 60 | 65 | 55 |
| Min. landing PAD size | um | D+150 | D+100 | D+125 | D+100 | D+125 | D+100 |
| Via hole aspect ratio | / | 0.8:1 | 1:1 | 0.8:1 | 1:1 | 0.8:1 | 1:1 |
| Impedance capability（＞50Ω） | ohm | +/- 10% | +/- 8% | +/- 10% | +/- 8% | +/- 8% | +/- 7% |
| Impedance capability（≤50Ω） | ohm | +/- 5ohm | +/- 4ohm | +/- 5ohm | +/- 4ohm | +/- 5ohm | +/- 4ohm |
| Solder mask registration | um | ± 25 | ± 20 | ± 25 | ± 20 | ± 25 | ± 20 |
| Min. solder mask dam | mm | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Min. through hole size | mm | 0.2 | 0.15 | 0.2 | 0.15 | 0.2 | 0.15 |
| Molding processing | mm | +/-0.1 | +/-0.075 | +/-0.1 | +/-0.075 | +/-0.075 | +/-0.05 |
R-F
| Technical characteristics | unit | 2024 | 2025 | 2026 | |||
| Mass | Sample | Mass | Sample | Mass | Sample | ||
| Dielectric thickness(FPC) | mm | 0.025~0.15 | 0.025~0.15 | 0.025~0.15 | 0.013~0.15 | 0.013~0.15 | 0.013~0.15 |
| Surface roughness | um | 50 | 50 | 50 | 30 | 50 | 30 |
| Min distance from the hole tothe Window | mm | 0.5 | 0.4 | 0.5 | 0.4 | 0.4 | 0.4 |
| Min distance from copper towindow | mm | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
| Window glue overflow | mm | 0.5 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
| Window min width | mm | 3.5 | 3.0 | 3.0 | 2.6 | 2.6 | 2.6 |
| Flex board finished copperthickness | OZ | 1/2-2 | 1/2-2 | 1/3-2 | 1/3-2 | 1/3-2 | 1/3-2 |
| Rigid board finish copperthickness | OZ | 1/2-4 | 1/3-4 | 1/3-4 | 1/3-4 | 1/3-4 | 1/3-4 |
| Min line width /space | mm | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.05/0.05 | 0.04/0.04 |
| Min board thickness | mm | 0.35 | 0.3 | 0.3 | 0.25 | 0.25 | 0.25 |
| Impedance capability | % | ±8 | ±7 | ±8 | ±7 | ±7 | ±5 |
| Bend control | % | ≤0.75 | ≤0.50 | ≤0.75 | ≤0.50 | ≤0.50 | ≤0.50 |
| Min completed PTH aperture | mm | 0.15 | 0.15 | 0.15 | 0.15 | 0.15 | 0.10 |
| Control depth tolerance | mm | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 | ±0.075 |
| HDI Type RF Laser Order | / | 3 Step | 4 Step | 3 Step | 4 Step | 4 Step | Anylayer |
| Number of soft boards in RF(hinge type) | / | ≤4 | ≤6 | ≤6 | ≤8 | ≤8 | ≤10 |
| Number of soft boards in RF(bonding) | / | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 |
Informationen
Anschrift：Songqi Commercial Building Room 703, Huanguan South Road No.128, Guanhu Longhua District, Shenzhen
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