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HSB18-232310

CUI Devices

Manufacturer Part #:

HSB18-232310

Manufacturer:

CUI Devices

Package:

Data Code:

Datasheet:

Description:

HEAT SINK, BGA, 23 X 23 X 10 MM

Quantity:

In Stock : 5332 Share

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

1

$0.988

$0.988
10

$0.9386

$9.386
25

$0.89148

$22.287
50

$0.86792

$43.396
100

$0.85623

$85.623
250

$0.79762

$199.405
500

$0.7507

$375.35
1000

$0.68033

$680.33
5000

$0.65687

$3284.35

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Specifications

Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	0.906" (23.00mm)
Length	0.906" (23.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.394" (10.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	20.41°C/W
Power Dissipation @ Temperature Rise	3.7W @ 75°C
Thermal Resistance @ Forced Air Flow	6.80°C/W @ 200 LFM

User Guide

Means of Payment

For your convenience, we accept multiple payment methods in USD, All of our payment options can be found on the Order payment page

Request for Quotations

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, UPS. We have various modes of transportation.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

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